LM358 Datasheet: Applications for Low Power Operational Amplifiers
Every engineer remembers the classic LM356 op-amp from their electronics lab classes. Looking for an op-amp for your next system? Every engineer is likely familiar with the LM358 and the specifications in the LM358 datasheet. This common op-amp has plenty of uses in DC and low-frequency AC applications. There are many other op-amps that provide […]
Electrical Component Availability Problems? Use Aggregated Sourcing Data
Would you design your board around this IC if you knew it wasn’t available? Use a search engine to check electrical component availability first. If you’ve designed a PCB and waited until the design was finished to check electrical component availability, you know the headache involved in redesigning the board around available components. With the […]
Common Op-Amp ICs and Selection Guidelines
Who doesn’t have a drawer full of LM741 op-amp ICs? Every engineer will develop an intimate relationship with op-amps during their electronics courses. These are fundamental circuits in analog electronics and are used as the building blocks for high-precision power systems, amplifiers, filters, and many other devices. You probably won’t be using the same op-amps […]
0402 Package Footprint: Sizes and Parameters
Thin film resistor in 0402 package. In modern electronics, miniaturization continues to drive component selection and system design. As engineers pack more functionality into smaller devices like wearables, IoT sensors, and mobile phones, the physical size of passive components shrinks accordingly. Among the vast array of Surface Mount Device (SMD) packages, the 0402 package has […]
Component Selection in Electronic System Design
My wife makes meticulous grocery shopping lists for us every week and we go to the store each weekend to restock the fridge and pantry. We know exactly what we need when mapping out each week and it causes us to spend less time wandering the aisles in the grocery store. Likewise, before you create […]
LGA Package Footprints and the Difficulty in Finding Full Package Models
Most HDI (high density interconnect) designers and many high speed designers are familiar with BGA (ball grid array) components, which provide a way to connect dense, high pin-count components to a PCB. These components function as a standard flip-chip BGA, but without solder balls for surface-mounting. LGA (land grid array) packages are designed to […]
How to Read a Component Datasheet: Parameters, Cautions, and Selection Processes
If you’ve worked with a component before and you’re very familiar with its specifications, you probably won’t need to read a datasheet. Whenever you’re comparing new components, or you need to know the limits of a new component, it’s critical that you scan through a datasheet to find the information you need. Some […]
Work With 3D Electronic Component Models in Your Circuit Design
With newer products becoming more complex and requiring strict mechanical constraints, your next device will need to feel the skillful touch of a CAM engineer. MCAD programs for PCB design can be used to carefully design a sleek enclosure around your 3D electronic component models. You need to be sure your enclosure fits around your […]
Electronic Parts Search, or EPS: Engineering at the Speed of Innovation
Symbols, footprints, and models can be difficult to find, but they are part of the foundation of any new electronic product. These important pieces of information need to be accurate representations of a component and need to be usable by your CAD software. It can be difficult to find correct component data and I’ve seen […]
Top Four Recommendations for Component Courtyard Management
Your component courtyards are a useful tool for ensuring components have sufficient space between them. This is a critical part of design and assembly; you need to make sure your components have enough space such that they can be hand assembled, arranged with a pick-and-place machine, or wave soldered. Your courtyard information can be easily […]