Electronic Component Allocation & Lead Times: 2023 Update
Electronic component allocation complicates product development from design to procurement; preparedness in an evolving market is key.
PCB Footprints
Optimizing Circuit Board and IC Packaging Design for Power Density
Optimizing IC packaging design increases power density and allows you to push the capabilities of your advanced technology design even...
Optimizing Thermal Management of Electronic Devices for High Power Density Designs
Optimal thermal management of electronic devices is becoming critical. This goal is possible with advanced packaging technology that targets power...
High Speed Layout Guidelines for Telecommunications
Are high speed layout guidelines for telecommunications really necessary? Yes, to ensure reliable operation and accurate signal processing.
IPC Component Spacing Guidelines for PCB Design
Avoid the pain of circuit board manufacturing and operational problems by applying the IPC component spacing guidelines to your next...
LM324n Datasheet: Quadruple Operational Amplifier
Can the LM324N datasheet alone be used for your PCB layout? Yes, but it is not advisable. To avoid footprint...
PCB Design Verification in Prototyping and the Transition to Production
The best PCB design verification is a collaborative process, where designer and CM employ tools that promote SW-HW integration, like...
The Next Generation of Brushless DC Motor Drivers: TI’s MCF8316A & MCT8316A
The brushless DC motor driver you choose can make a profound difference in the complexity and time needed for your...
How to Read a Circuit Board Schematic: Understanding Design Elements
Do you know how to read a circuit board schematic? Here are a few tips that might be helpful to...
10 Key Design Practices for the PCB Assembly Process
Understanding the PCB assembly process is a major step towards optimizing the quality of your PCBA.
