Toshiba’s TCK42xG Series: MOSFET Drivers for Mobile, Wearable and IoT Devices
The TCK42xG series of MOSFET drivers offers a wide range of options for power line management in your mobile, wearable...
PCB Design & Layouts
TI innovative GaN Technology for Telecom & Server Power Designs
TI GaN technology innovation is raising the bar for telecommunication and server power supply unit efficiency.
Design Essentials for Smart EV Charging System Control
Optimal smart Ev charging system unit design requires knowing and satisfying the essential development keys for longevity, flexibility, safety and...
STM32CubeMX: Customizable Software for Smart Board Development
Combining MCP23017 datasheet information with accessible and accurate CAD data from a trusted source will help you achieve the most...
Optimizing Thermal Management of Electronic Devices for High Power Density Designs
Optimal thermal management of electronic devices is becoming critical. This goal is possible with advanced packaging technology that targets power...
TI TPS7H5001-SP: Dual Output PWM Controller for Mission Critical LEO Satellites
The TI TPS7H5001 controller provides a reliable power management solution for mission critical converter systems aboard LEO space vehicles.
Discrete Components vs Integrated Circuits: Similarities & Differences
When it comes to discrete components vs integrated circuits, the choice depends on a lot of factors including budget and...
TI ADC12DJ3200: Advanced High Speed ADC Built for Harsh Environments
TI's ADC12DJ3200 is a 12-bit, dual-channel RF-Sampling high speed ADC with buffered analog input that ticks all the boxes of...
Flip-Chip BGA: PCB Layout Best Practices
A quick guide on best layout practices for Flip Chip BGAs along with essential knowledge supplements to help you get...
Best Design Practices for Power and Signal Connectors
Does your choice of power and signal connectors really matter? Yes, and you should follow good guidelines to ensure they...
